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1

Plasma-Over-Treatment Model on Patterned Nanometer MOCVD-TiN Contact Glue Layer

Chang, Shih-Chieh, Wang, Ying-Lang

Journal:

Electrochemical and Solid-State Letters

Year:

2006

Language:

english

File:

PDF, 242 KB

english, 2006

2

Effects of wetting ability of plating electrolyte on Cu seed layer for electroplated copper film

Liu, Chi-Wen, Tsao, Jung-Chih, Tsai, Ming-Shih, Wang, Ying-Lang

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2004

Language:

english

File:

PDF, 637 KB

english, 2004

3

Uniform CoSi2 nano-nucleus formation by oxide mediated silicidation with a Ti capping layer

Juin-Jie Chang, Tsung-Eong Hsieh, Chuan-Pu Liu, Ying-Lang Wang

Journal:

Thin Solid Films

Year:

2006

Language:

english

File:

PDF, 265 KB

english, 2006

4

Width-dependent anomalous CoSix sheet resistance change by Ti and TiN capping process

Yen-Ming Chen, George C. Tu, Ying-Lang Wang

Journal:

Thin Solid Films

Year:

2006

Language:

english

File:

PDF, 151 KB

english, 2006

5

Effects of direct current and pulse-reverse copper plating waveforms on the incubation behavior of self-annealing

Min-Yuan Cheng, Kei-Wei Chen, Tzeng-Feng Liu, Ying-Lang Wang, Hsien-Ping Feng

Journal:

Thin Solid Films

Year:

2010

Language:

english

File:

PDF, 2.29 MB

english, 2010

6

Effect of N2/H2 plasma treatment on the moisture adsorption of MOCVD–TiN films

J.K. Huang, Cheng-Liang Huang, Shih-Chieh Chang, Yi-Lung Cheng, Ying-Lang Wang

Journal:

Thin Solid Films

Year:

2011

Language:

english

File:

PDF, 744 KB

english, 2011

7

Effects of (002) β-Ta barrier on copper chemical mechanical polishing behavior

Wang, Yu-Sheng, Chen, Kei-Wei, Cheng, Min-Yuan, Lee, Wen-Hsi, Wang, Ying-Lang

Journal:

Thin Solid Films

Year:

2013

Language:

english

File:

PDF, 319 KB

english, 2013

8

Moisture effect on electromigration characteristics for copper dual damascene interconnection

Cheng, Yi-Lung, Chang, Wei-Yuan, Wang, Ying-Lang

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2010

Language:

english

File:

PDF, 724 KB

english, 2010

9

Investigation of Galvanic Corrosion Between TaN[sub x] Barriers and Copper Seed by Electrochemical Impedance Spectroscopy

Hung, Chi-Cheng, Lee, Wen-Hsi, Wang, Yu-Sheng, Chang, Shih-Chieh, Wang, Ying-Lang

Journal:

Electrochemical and Solid-State Letters

Year:

2007

Language:

english

File:

PDF, 316 KB

english, 2007

10

Effect of Bias Sputtering on Step Coverage of Thin Tantalum-Based Copper Barriers

Wang, Yu-Sheng, Lee, Wen-Hsi, Wang, Ying-Lang, Chan, Din-Yuen, Chang, Shih-Chieh

Journal:

Nanoscience and Nanotechnology Letters

Year:

2009

Language:

english

File:

PDF, 1.01 MB

english, 2009

11

The electrical property of plasma-treated Ta/TaNx diffusion barrier

Yu-Sheng Wang, Wen-Hsi Lee, Ying-Lang Wang, Chi-Cheng Hung, Shih-Chieh Chang

Journal:

Journal of Physics and Chemistry of Solids

Year:

2008

Language:

english

File:

PDF, 341 KB

english, 2008

12

The study of diffusion and nucleation for CoSi2 formation by oxide-mediated cobalt silicidation

Juin-Jie Chang, Chuan-Pu Liu, Tsung-Eong Hsieh, Ying-Lang Wang

Journal:

Surface and Coatings Technology

Year:

2006

Language:

english

File:

PDF, 399 KB

english, 2006

13

Application of plasma immersion ion implantation on seeding copper electroplating for multilevel interconnection

Shao-Yu Chiu, Ying-Lang Wang, Shih-Chieh Chang, Ming-Shiann Feng

Journal:

Thin Solid Films

Year:

2005

Language:

english

File:

PDF, 558 KB

english, 2005

14

High-selectivity damascene chemical mechanical polishing

Shao-Yu Chiu, Ying-Lang Wang, Chuan-Pu Liu, Shih-Chieh Chang, Gwo-Jen Hwang, Ming-Shiann Feng, Chia-Fu Chen

Journal:

Thin Solid Films

Year:

2006

Language:

english

File:

PDF, 92 KB

english, 2006

15

Phase transformation of tantalum on different dielectric films with plasma treatment

Chun-Chieh Huang, Ying-Lang Wang, Shih-Chieh Chang, Gwo-Jen Hwang, Jow-Lay Huang

Journal:

Thin Solid Films

Year:

2006

Language:

english

File:

PDF, 158 KB

english, 2006

16

Interface integration defect of copper and low-K materials beyond nano-scale copper damascene process

Kei-Wei Chen, Ying-Lang Wang, Jung-Chih Tsao, Yungder Juang, Feng-Yi Lee

Journal:

Journal of Physics and Chemistry of Solids

Year:

2008

Language:

english

File:

PDF, 430 KB

english, 2008

17

Monitor and eliminate the circular defects in HDP–STI deposition through oxynitride/oxide composite liner

Jin-Kun Lan, Ying-Lang Wang, Chuan-Pu Liu, Wen His Lee, Chyung Ay, Yi-Lung Cheng, Shih-Chieh Chang

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 746 KB

english, 2004

18

Investigating bipolar resistive switching characteristics in filament type and interface type BON-based resistive switching memory

Tseng, Hsueh-Chih, Chang, Ting-Chang, Cheng, Kai-Hung, Huang, Jheng-Jie, Chen, Yu-Ting, Jian, Fu-Yen, Sze, Simon M., Tsai, Ming-Jinn, Chu, Ann-Kuo, Wang, Ying-Lang

Journal:

Thin Solid Films

Year:

2013

Language:

english

File:

PDF, 1.03 MB

english, 2013

19

Effect of polyimide baking on bump resistance in flip-chip solder joints

Cheng, Hsi-Kuei, Feng, Shien-Ping, Lai, Yi-Jen, Liu, Kuo-Chio, Wang, Ying-Lang, Liu, Tzeng-Feng, Chen, Chih-Ming

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 847 KB

english, 2014

20

An electroplating method for copper plane twin boundary manufacturing

Wang, Yu-Sheng, Lee, Wen-Hsi, Chang, Shih-Chieh, Nian, Jun-Nan, Wang, Ying-Lang

Journal:

Thin Solid Films

Year:

2013

Language:

english

File:

PDF, 1.35 MB

english, 2013

21

Comprehensive comparison of electrical and reliability characteristics of various copper barrier films

Cheng, Yi-Lung, Wu, Jiung, Chiu, Tai-Jung, Chen, Shiuan-An, Wang, Ying-Lang

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2011

Language:

english

File:

PDF, 975 KB

english, 2011

22

Effect of plating current density and annealing on impurities in electroplated Cu film

Liu, Chi-Wen, Wang, Ying-Lang, Tsai, Ming-Shih, Feng, Hsien-Ping, Chang, Shih-Chieh, Hwang, Gwo-Jen

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2005

Language:

english

File:

PDF, 607 KB

english, 2005

23

Reduction of Etch Pits of Electropolished Cu by Additives

Shieh, Jia-Min, Chang, Shih-Chieh, Wang, Ying-Lang, Dai, Bau-Tong, Cheng, Shih-Song, Ting, Jack

Journal:

Journal of The Electrochemical Society

Year:

2004

Language:

english

File:

PDF, 793 KB

english, 2004

24

Bis-(3-sodiumsulfopropyl disulfide) Decomposition with Cathodic Current Flowing in a Copper-Electroplating Bath

Lee, Wen-Hsi, Hung, Chi-Cheng, Chang, Shih-Chieh, Wang, Ying-Lang

Journal:

Journal of The Electrochemical Society

Year:

2010

Language:

english

File:

PDF, 717 KB

english, 2010

25

Investigation of Barrier Property of Copper Manganese Alloy on Ruthenium

Su, Yin-Hsien, Wu, Sze-Ann, Wu, Chia-Yang, Wang, Ying-Lang, Lee, Wen-Hsi

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2015

Language:

english

File:

PDF, 1.98 MB

english, 2015

26

Superpolishing for Planarizing Copper Damascene Interconnects

Chang, Shih-Chieh, Shieh, Jia-Min, Dai, Bau-Tong, Feng, Ming-Shiann, Li, Ying-Hao, Shih, C. H., Tsai, M. H., Shue, S. L., Liang, R. S., Wang, Ying-Lang

Journal:

Electrochemical and Solid-State Letters

Year:

2003

Language:

english

File:

PDF, 256 KB

english, 2003

27

Effect of Cu Ions on the Corrosion Behavior of the Cu Electropolishing Processes

Kung, Te-Ming, Wang, Ying-Lang, Liu, Chuan-Pu, Chang, Shih-Chieh

Journal:

Nanoscience and Nanotechnology Letters

Year:

2009

Language:

english

File:

PDF, 762 KB

english, 2009

28

A Study on the Diffuse Mechanism and the Barrier Property of Copper Manganese Alloy on Tantalum

Su, Ying-Sen, Lee, Wen-Hsi, Chang, Shih-Chieh, Wang, Ying-Lang

Journal:

IEEE Journal of the Electron Devices Society

Year:

2015

Language:

english

File:

PDF, 4.22 MB

english, 2015

29

Mechanism of the metal–insulator–metal capacitance drift for advanced mixed-signal copper process device

Shiu-Ko JangJian, Ying-Lang Wang, Miao-Cheng Liao, Hung-Jui Chang, Yungder Juang

Journal:

Journal of Physics and Chemistry of Solids

Year:

2008

Language:

english

File:

PDF, 1.12 MB

english, 2008

30

Mechanism of over-etching defects during Ta/TaN barrier resputtering in micro-trench for Cu metallization

Jung-Chih Tsao, Chuan-Pu Liu, Ying-Lang Wang, Kei-Wei Chen, Kuang-Yao Lo

Journal:

Journal of Physics and Chemistry of Solids

Year:

2008

Language:

english

File:

PDF, 523 KB

english, 2008

31

Thermal properties of hydrogenated amorphous silicon prepared by high-density plasma chemical vapor deposition

Wen-Chu Hsiao, Chuan-Pu Liu, Ying-Lang Wang

Journal:

Journal of Physics and Chemistry of Solids

Year:

2008

Language:

english

File:

PDF, 362 KB

english, 2008

32

Effects of plasma treatment on the precipitation of fluorine-doped silicon oxide

Jun Wu, Ying-Lang Wang, Cheng-Tzu Kuo

Journal:

Journal of Physics and Chemistry of Solids

Year:

2008

Language:

english

File:

PDF, 1013 KB

english, 2008

33

Controlling Ta phase in Ta/TaN bilayer by surface pre-treatment on TaN

Jung-Chih Tsao, Chuan-Pu Liu, Ying-Lang Wang, Yu-Sheng Wang, Ke-Wei Chen

Journal:

Journal of Physics and Chemistry of Solids

Year:

2008

Language:

english

File:

PDF, 238 KB

english, 2008

34

Bonding configuration and electrical properties of nitrogen and fluorine incorporated SiOC:H thin film prepared by plasma enhanced chemical vapor deposition

Shiu-Ko JangJian, Ying-Lang Wang

Journal:

Surface and Coatings Technology

Year:

2006

Language:

english

File:

PDF, 171 KB

english, 2006

35

Precipitates formation and its impact on the structure of plasma-deposited fluorinated silicon oxide films

Jun Wu, Ying-Lang Wang, Cheng-Tzu Kuo

Journal:

Surface and Coatings Technology

Year:

2006

Language:

english

File:

PDF, 287 KB

english, 2006

36

Thermal stability and bonding configuration of fluorine-modified low-k SiOC:H composite films

Shiu-Ko JangJian, Chuan-Pu Liu, Ying-Lang Wang, Weng-Sing Hwang, Wei-Tsu Tseng

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 704 KB

english, 2004

37

Chemical–mechanical polish of aluminum alloy thin films: slurry chemistries and polish mechanisms

Ying-Lang Wang, Wei-Tsu Tseng, Shih-Chieh Chang

Journal:

Thin Solid Films

Year:

2005

Language:

english

File:

PDF, 438 KB

english, 2005

38

Characterization of sputter-induced temperature effect in fluorine doped SiO2 film deposition by high-density plasma chemical vapor deposition

Wen-Chu Hsiao, Chuan-Pu Liu, Ying-Lang Wang

Journal:

Thin Solid Films

Year:

2006

Language:

english

File:

PDF, 166 KB

english, 2006

39

Investigation of deplating behavior of Pt contact pins in semiconductor Cu electroplating process

Shao-Yu Hu, Chi-Cheng Hung, Wen-Hsi Lee, Shih-Chieh Chang, Din-Yuen Chan, Ying-Lang Wang

Journal:

Thin Solid Films

Year:

2008

Language:

english

File:

PDF, 481 KB

english, 2008

40

Microstructure-related resistivity change after chemical–mechanical polish of Al and W thin films

Wei-Tsu Tseng, Ying-Lang Wang, James Niu

Journal:

Thin Solid Films

Year:

2000

Language:

english

File:

PDF, 138 KB

english, 2000

41

The effect of oxygen content on bonding configuration and properties of low-k organosilicate glass dielectric film

Sheng-Wen Chen, Chuan-Pu Liu, Shiu-Ko JangJian, Ying-Lang Wang

Journal:

Journal of Physics and Chemistry of Solids

Year:

2008

Language:

english

File:

PDF, 417 KB

english, 2008

42

Plasma treatment effects on hydrogenated amorphous carbon films prepared by plasma-enhanced chemical vapor deposition

Jun Wu, Ying-Lang Wang, Cheng-Tzu Kuo

Journal:

Journal of Physics and Chemistry of Solids

Year:

2008

Language:

english

File:

PDF, 410 KB

english, 2008

43

Plasma over-treatment effect on the MOCVD-TiN contact glue layer

Shih-Chieh Chang, Ying-Lang Wang, Din-Yuen Chan, J.K. Huang, Ming-Tsong Wang

Journal:

Surface and Coatings Technology

Year:

2008

Language:

english

File:

PDF, 530 KB

english, 2008

44

Oxide-mediated formation of epitaxy silicide on heavily doped Si surfaces and narrow width active region

Yen-Ming Chen, George C. Tu, Ying-Lang Wang

Journal:

Thin Solid Films

Year:

2006

Language:

english

File:

PDF, 135 KB

english, 2006

45

Under-layer behavior study of low resistance Ta/TaNx barrier film

Yu-Sheng Wang, Chi-Cheng Hung, Wen-Hsi Lee, Shih-Chieh Chang, Ying-Lang Wang

Journal:

Thin Solid Films

Year:

2008

Language:

english

File:

PDF, 473 KB

english, 2008

46

Study on precipitations of fluorine-doped silicon oxide

Jun Wu, Ying-Lang Wang, Chuan-Pu Liu, Shih-Chieh Chang, Cheng-Tzu Kuo, Chyung Ay

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 623 KB

english, 2004

47

Fluorine-modified low-k a-SiOC:H composite films prepared by plasma enhanced chemical vapor deposition

Shiuh-Ko JangJean, Chuan-Pu Liu, Ying-Lang Wang, Weng-Sing Hwang, Wei-Tsu Tseng, Sheng-Wen Chen, Kuang-Yao Lo

Journal:

Thin Solid Films

Year:

2004

Language:

english

File:

PDF, 284 KB

english, 2004

48

The technology for analyzing the conditions of rapid thermal annealing by optical second harmonic generation

Kuang-yao Lo, Ying-lang Wang, Jun-de Jin

Journal:

Thin Solid Films

Year:

2002

Language:

english

File:

PDF, 266 KB

english, 2002

49

The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer

Shao-Yu Chiu, Ying-Lang Wang, Chuan-Pu Liu, Jin-Kun Lan, Chyung Ay, Ming-Shiann Feng, Ming-Shih Tsai, Bau-Tong Dai

Journal:

Materials Chemistry and Physics

Year:

2003

Language:

english

File:

PDF, 320 KB

english, 2003

50

A Novel Synthesis of a CuInSe2 Thin Film from Electrodeposited Cu–Se–In–Se Precursors with Three Steps Annealing

Hu, Shao-Yu, Lee, Wen-Hsi, Chang, Shih-Chieh, Wang, Ying-Lang

Journal:

Journal of Nanoscience and Nanotechnology

Year:

2012

Language:

english

File:

PDF, 5.96 MB

english, 2012

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